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preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 1 general description the AP3408 is a current mode, pwm synchronous buck dc/dc converter, capable of driving a 2a load with high efficiency, excellent line and load regulation. it operates in continuous pwm mode. the AP3408 integrates synchronous p-channel and n-channel power mosfet switches with low on-resistance. it is ideal for portable applications powered from a single li-ion battery. 100% duty cycle and low on-resistance p-channel internal power mosfet can maximize the battery life. the switching frequency of AP3408 can be programmable from 300khz to 4mhz, which allows small-sized components, such as capacitors and inductors . a standard series of inductors from several different manufacturers are available. this feature greatly simplifies the design of switch-mode power supplies. the AP3408 is available in dfn-33-10 and psop-8 packages. features ? input voltage range: 2.6 to 5.5v ? adjustable output from 0.8 to 5v ? 0.8v reference voltage with 2% precision ? output current: 2a ? high efficiency up to 95% ? low r dson internal switches ? programmable frequency: 300khz to 4mhz ? current mode control ? forced continuous-mode operation ? 100% duty cycle ? synchronizable switching frequency ? power good output voltage monitoring ? built-in soft-start ? built-in short circuit protection ? built-in thermal shutdown protection ? built-in current limit function applications ? portable media player ? digital still and video cameras ? notebook figure 1. package types of AP3408 dfn-33-10 psop-8
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 2 pi n 1 dot by marking 1 2 3 4 5 10 9 8 7 6 shdn/rt sync gnd sw pgnd comp fb pgood vdd pvdd exposed pad connected to pgnd 1 2 3 4 8 7 6 5 shdn/rt gnd sw pgnd pvdd vdd fb comp exposed pad connected to pgnd pin configuration dn package mp package (dfn-33-10) (psop-8) figure 2. pin configuration of AP3408 (top view) pin description pin number dfn-33-10 psop-8 pin name description 1 1 shdn/rt oscillator resistor input. connect a resistor to gnd from this pin to set the switching frequency. forcing this pin to v dd to shutdown the device 2 sync external clock synchronization input. the oscillation frequency can be synchronized to an external oscillation applied to this pin. when tied to vdd, the internal oscillator is selected 3 2 gnd signal ground. all small-signal ground, such as the compensation components and the exposed pad should be connected to this pin, which in turn connects to pgnd at one point 4 3 sw internal power switch output. connect this pin with one terminal of the inductor 5 4 pgnd power ground. connect this pin as close as possible to cin and cout 6 5 pvdd power input supply. decouple this pin to pgnd with a capacitor 7 6 vdd signal input supply. decouple this pin to gnd with a capacitor. normally v dd is equal to v pvdd 8 pgood power good indicator. open-drain logic output that is pulled to ground when the output voltage is not within 12.5% of regulation point 9 7 fb feedback voltage. this pin is the inverting input of internal error amplifier. it senses the converter output voltage through an external resistor di vider. the internal reference voltage is 0.8v, which determines the output voltage through the resistor divider 10 8 comp compensation input. this pin is the output of internal error amplifier. connect external compensation elements to this pin to stabilize the control loop
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 3 functional block diagram sd oscillator sum cs 0.8v ea ocp driver control logic otp uvlo v ref 0.9v shdn/rt pvdd sw gnd pgnd pgood fb comp 1(1) 3(2) 10(8) 4(3) 5(4) 6(5) 8 9(7) pwm clamp ss dc sync 2 0.7v 0.4v vdd 7(6) a (b) a for dfn-3x3-10 b for psop-8 figure 3. functional block diagram of AP3408
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 4 ordering information AP3408 - g1: green circuit type part number marking id package temperature range green green packing type dfn-33-10 AP3408dntr-g1 bfa tape & reel AP3408mp-g1 3408mp-g1 tube psop-8 -40 to 125 c AP3408mptr-g1 3408mp-g1 tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. absolute maximum ratings (note 1) parameter symbol value unit vdd pin voltage v dd -0.3 to 6 v pvdd pin voltage v pvdd -0.3 to 6 v fb pin voltage v fb -0.3 to 6 v comp pin voltage v comp -0.3 to 6 v sw pin voltage v sw -0.3 to v in +0.3 v shdn/rt pin voltage v shdn/rt -0.3 to 6 v dfn-33-10 110 thermal resistance psop-8 ja 75 oc/w operating junction temperature t j 150 oc storage temperature t stg -65 to 150 oc lead temperature (soldering, 10 sec) t lead 260 oc esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. tr: tape & reel blank: tube package dn: dfn-33-10 mp: psop-8
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 5 recommended operating conditions parameter symbol min max unit input voltage v in 2.6 5.5 v maximum output current i out (max) 2 a operating junction temperature t j -40 125 oc electrical characteristics v in =v dd =v pvdd =3.3v, t a =25 , unless otherwise specified. parameters symbol conditions min typ max unit input section input voltage range v dd 2.6 5.5 v supply current i q v fb =0.75v, no switching 460 a shutdown supply current i shdn shutdown, v in =5.5v 1 a under voltage threshold lockout v uvlo v dd rising 2.2 v under voltage hysteresis lockout v huvlo 300 mv feedback section feedback voltage v fb 0.784 0.8 0.816 v fb pin bias current i fb 0.1 0.4 a current sense transresistance r t 0.2 switching leakage current v shdn/rt =v in =5.5v 1 a error gain amplifier voltage g v 800 error 1 amplifier 1 trans-conductance g s 800 a /v
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 6 electrical characteristics (continued) v in =v dd =v pvdd =3.3v, t a =25 , unless otherwise specified. parameters symbol conditions min typ max unit oscillator section rt pin voltage v rt 0.8 v r osc =330k 0.8 1 1.2 mhz switching frequency f osc adj frequency 0.3 4 mhz maximum duty cycle d max v fb =0.75v 100 % power switch section switch current limit i limit v fb =0.75v 2.2 3.8 a internal p-fet on resistance r pdson i sw =500ma 0.11 0.16 internal n-fet on resistance r ndson i sw =-500ma 0.11 0.17 shdn/rt section shutdown threshold v dd -0.7 v dd -0.4 v pgood section pgood voltage range 12.5 15 % pgood pull down resistance 120 total device output current i out v dd =2.6 to 5.5v v out =2.5v 2 a output voltage line regulation lnr v dd =2.7 to 5.5v i out =100ma 0.4 %/v output voltage load regulation lod i out =0.01 to 2a 0.2 % soft-start time t ss i out 10ma 1.5 ms thermal shutdown temperature t otsd 160 oc thermal shutdown temperature hysteresis t hys 20 oc
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 7 typical performance characteristics v in =v dd =v pvdd =3.3v, t a =25 , unless otherwise specified. figure 4. supply current vs. input voltage figure 5. supply current vs. ambient temperature figure 6. efficiency vs. output current figure 7. pmos on resistance vs. ambient temperature -60 -30 0 30 60 90 120 150 100 200 300 400 500 600 700 supply current ( a ) ambient temperature ( o c) v in =3.3v v fb =0.75v 0 500 1000 1500 2000 2500 30 40 50 60 70 80 90 100 efficiency (%) output current (ma) v out =2.5v v in =3.3v v in =5.0v -60 -30 0 30 60 90 120 150 60 80 100 120 140 pmos on resistance ( m ) ambient temperature ( o c) v in =3.3v v fb =0.75v 2.53.03.54.04.55.05.56.0 100 200 300 400 500 600 supply current ( a ) input voltage (v) v fb =0.75v
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) v in =v dd =v pvdd =3.3v, t a =25 , unless otherwise specified. figure 8. nmos on resistance vs. figure 9. frequency vs. ambient temperature ambient temperature figure 10. v fb vs. ambient temperature figure 11. current limit vs. ambient temperature -60 -30 0 30 60 90 120 150 60 80 100 120 140 nmos on resistance ( m ) ambient temperature ( o c ) v in =3.3v v fb =0.85v -60 -30 0 30 60 90 120 150 0.7 0.8 0.9 1.0 1.1 1.2 frequency (mhz) ambient temperature ( o c ) r osc =330k v in =3.3v v out =2.5v -60 -30 0 30 60 90 120 150 0.5 0.6 0.7 0.8 0.9 v fb (v) ambient temperature ( o c ) v in =3.3v v out =2.5v -40 0 40 80 120 160 2.5 3.0 3.5 4.0 4.5 5.0 current limit (a) temperature ( o c) v in =3.3v
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 9 typical application figure 12. typical application of AP3408
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 10 mechanical dimensions dfn-33-10 unit: mm(inch) ` 2.900(0.114) 3.100(0.122) 2.900(0.114) 3.100(0.122) 1.600(0.063) 1.800(0.071) 0.200(0.008) 0.300(0.012) 0.500(0.020) typ 0.300(0.012) 0.500(0.020) 0.000(0.000) 0.050(0.002) 0.700(0.028) 0.800(0.031) 0.153(0.006) 0.253(0.010) 2.300(0.090) 2.500(0.098) n1 n5 n6 n10 pin #1 identification pin 1 dot by marking
preliminary datasheet 2a, 4mhz high efficiency sy nchronous buck converter AP3408 jul. 2011 rev. 1. 0 bcd semiconductor manufacturing limited 11 mechanical dimensions (continued) psop-8 unit: mm(inch) 3.202(0.126) 3.402(0.134)
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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